Structural Potting Compound Short Cure Cycle
S-2673E Epoxy Potting Compound is a two-part, low viscosity product. S-2673E has been specially formulated to cure with low exotherm, even when mixed in bulk quantities. The low viscosity and good wetting properties of S-2673E Epoxy Potting Compound permit rapid penetration into small gaps and facilitate surface coating. After mixing, it has a pot life of approximately 4 hours. S-2673E Epoxy Potting Compound is specially designed to encapsulate electronic components and circuitry e.g. coils, transformers and electronic assemblies.
Encapsulating electronic components and circuitry e.g. coils, transformers and electronic assemblies
- low viscosity
- good wetting properties
- short cure cycle