Structural Potting Compound Short Cure Cycle

S-2673E

Description
S-2673E Epoxy Potting Compound is a two-part, low viscosity product. S-2673E has been specially formulated to cure with low exotherm, even when mixed in bulk quantities. The low viscosity and good wetting properties of S-2673E Epoxy Potting Compound permit rapid penetration into small gaps and facilitate surface coating. After mixing, it has a pot life of approximately 4 hours.
Applications

S-2673E Epoxy Potting Compound is specially designed to encapsulate electronic components and circuitry e.g. coils, transformers and electronic assemblies.

Advantages
  • low viscosity
  • good wetting properties
  • short cure cycle
  • good resistance to some chemicals
Substrates
  • Metals
  • Plastics