Structural Potting Compound Short Cure Cycle

S-2673E

Description
S-2673E Epoxy Potting Compound is a two-part, low viscosity product. S-2673E has been specially formulated to cure with low exotherm, even when mixed in bulk quantities. The low viscosity and good wetting properties of S-2673E Epoxy Potting Compound permit rapid penetration into small gaps and facilitate surface coating. After mixing, it has a pot life of approximately 4 hours. S-2673E Epoxy Potting Compound is specially designed to encapsulate electronic components and circuitry e.g. coils, transformers and electronic assemblies.
Applications

Encapsulating electronic components and circuitry e.g. coils, transformers and electronic assemblies

Advantages
  • low viscosity
  • good wetting properties
  • short cure cycle
Substrates
  • Metals
  • Plastics
Packs available
  • 1.5 kg set
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