Structural Two Part Epoxy Potting Compound Long Cure Cycle

S-211E

Description
S-211E Epoxy Potting Compound is a two-part, low viscosity product.  S-211E has been specially formulated to cure with low exotherm, even when mixed in bulk quantities.  The low viscosity and good wetting properties of S-211E Epoxy Potting Compound permit rapid penetration into small gaps and facilitate surface coating. After mixing, it has a pot life of approximately 4 hours.
Applications

S-211E Epoxy Potting Compound is specially designed to encapsulate electronic components and circuitry e.g. coils, transformers and electronic assemblies.

Advantages
  • Good chemical resistance
  • good heat resistance
  • low viscosity
  • good wetting properties
  • low exotherm cure
Substrates
  • Metals
  • Plastics
  • Rigid plastics
  • Steel
Packs available
  • 1.5kg dosed set