Structural Two Part Epoxy Potting Compound Long Cure Cycle

S-211E

Description
S–211E Epoxy Potting Compound is a two-part, low viscosity product.  S–211E has been specially formulated to cure with low exotherm, even when mixed in bulk quantities.  The low viscosity and good wetting properties of S–211E Epoxy Potting Compound permit rapid penetration into small gaps and facilitate surface coating.  After mixing, it has a pot life of approximately 4 hours.
Applications

S–211E Epoxy Potting Compound is specially designed to encapsulate electronic components and circuitry e.g. coils, transformers and electronic assemblies.

Advantages
  • Good chemical resistance
  • good heat resistance
  • low viscosity
  • good wetting properties
  • low exotherm cure
Substrates
  • Metals
  • Plastics
  • Rigid plastics
  • Steel
Related industry
Packs available
  • 1.5kg dosed set