Description
S-211E Epoxy Potting Compound is a two-part, low viscosity product. S-211E has been specially formulated to cure with low exotherm, even when mixed in bulk quantities. The low viscosity and good wetting properties of S-211E Epoxy Potting Compound permit rapid penetration into small gaps and facilitate surface coating. After mixing, it has a pot life of approximately 4 hours.
Applications
S-211E Epoxy Potting Compound is specially designed to encapsulate electronic components and circuitry e.g. coils, transformers and electronic assemblies.
Advantages
- Good chemical resistance
- good heat resistance
- low viscosity
- good wetting properties
- low exotherm cure
Substrates
- Metals
- Plastics
- Rigid plastics
- Steel
Packs available
- 1.5kg dosed set
