Product Overview
S-211E Epoxy Potting Compound is a two-part, low viscosity product. S-211E has been specially formulated to cure with low exotherm, even when mixed in bulk quantities. The low viscosity and good wetting properties of S-211E Epoxy Potting Compound permit rapid penetration into small gaps and facilitate surface coating. After mixing, it has a pot life of approximately 4 hours.
Key Features
- low viscosity
- good wetting
- low exotherm
Applications
S-211 E epoxy potting compound is specially designed to encapsulate electronic components and circuitry e.g. coils, transformers and electronic assemblies.
Technical Specifications
- mix ratio:2:1 by weight
- Working Time:4 hours at 22C
- Cure Time: 8 hours at 22C
- Colour: clear
- Shelf Life 12 months at room temperature
Packaging Options
- 1.5kg set
- Other sizes on request
Compatible Substrates
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